V-CAPS will build a 30,000 square meter assembly and test facility, providing a full range of two chipscale package families, QFN and FBGA. V-CAPS will be 100% “GREEN” as defined by today’s industry standards and will maintain a “green” philosophy in its approach to business. Culturally, V-CAPS will operate as a “lean six sigma” company focused on delivering greater client value and higher quality than its peers. The factory will be facilitized with the most advanced clean room, chemical treatment, and air handling systems in order to maintain the highest quality of output.
QFN (Quad Flat No-lead) is a leadframe based package selected based on its high rate of adoption and growth. QFN is the fastest growing package in the history of the Semiconductor Industry. This package family will be the first launched of the two families to be produced. The QFN package applies to a broad array of semiconductor chip designs and applications including consumer, communications and automotive segments.
FBGA (fine pitch ball grid array) is a laminate based packaging technology also projected to grow rapidly over the next several years in terms of both unit volume and applications. FBGAs are used in virtually every area of the Semiconductor Industry today. V-CAPS will concentrate its manufacturing on those FBGAs with ball counts between 80 and 400. V-CAPS intends to manufacture its FBGAs on the highest density strips available to further minimize unit cost.
The demand by customers for full turnkey assembly and test is critical to V-CAPS’ strategy. Test requires significant capital expenditures and has a direct impact on overall cycle times and more importantly on profitability. The V-CAPS’ strategy is to offer strip testing on no more than two tester platforms. Hence, the selection of test platforms is critical to both customer selection and overall product cost.
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